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Find the most up-to-date version of JIS C at Engineering Bending, Cycles, JIS-C, R=2mm,°, >, > Electrical conductivity, S/cm, JIS K , , Heat resistance, °C, TG-DTA, , 20 ºC x 2, cycles, JIS C Retention ratio of tensile strength and elongation after immersion for 5 minutes according to JIS C, >80%.

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Circuit board print copper layer peel strength test This is the jjs bond strength test of copper print on circuit board. Hook and loop fastener peel strength test This is the peel bond strength test of hook and loop fastener. This is the shear test to ensure sloder joint strength of chip components.

Peel / Adhesion

Corrugated cardboard sealing peel strength test This is sealing peel strength test of corrugated cardboard. Concrete strength test This is performed to analyze transition in time of concrete viscosity tension strength.

JIS S “Guidelines for all people including elderly and people with disabilities-Packaging and receptacles-Test methods for opening”. Embossed jls tape peel adhesion test This is the peel strength adhesion test of embossed carrier tape. This is the peel strength adhesion test of embossed carrier tape. Cup film lid opening peel strength test This is the peel test of film lid of cups for such as pudding or jelly.

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KANEKA | Electrical and electronic materials

Inquiry about this testing application. This is the 90 degree peel test of adhesive tape. Finally ,some samples cannot be measured depending on their materials or shapes, so please contact us for technical advice before purchase decision so that we offer the best testing system for you. This is the degree peel test of adhesive tape. Finally, some samples cannot be measured depending on their materials or shapes, so please contact us for technical advice before purchase decision so that we offer the best testing system for you.

Heat seal strength test This is the peel test of heat seal of a variety of packaging bags snack for food etc. Packaging of surface mount components on continuous tapes” Partly Corresponding Japanese standard: Chip components solder joints shear strength test This is the shear test to ensure sloder joint strength of chip components. Digital force gauge for handheld use DSV series. Fixture for Shear Test LF. Besides, 2 pieces of FC series grips are necessary to perform this test.

IPT series are designed for peel test only, so it makes measurement efficiency higher. Book binding adhesion bond test This test is performed to ensure binding adhesion bonding strength of pages. Method for shear strength of solder joints on chip components”. The fixture PN keeps peel degree at Some samples cannot be measured depending on their materials or shapes, so please contact us for technical advice before purchase decision so that we offer the best testing system for you.

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Adhesive tape 90 degree peel bond strength test Circuit board print copper layer peel strength test Adhesive tape degree peel bond strength test Adhesive tape peel strength test Embossed carrier tape peel adhesion test Hook and loop fastener peel strength test Heat seal strength test Cup film lid opening peel strength test Chip components solder joints shear strength test Corrugated cardboard sealing peel strength test Probe tack test of adhesive plaster bandage Book binding adhesion bond test Cheese texture viscosity or hardness analysis Hand cream viscosity softness test Concrete strength test.

Adhesive tape 90 degree peel bond strength test This is the 90 degree peel test of adhesive tape. Hand cream viscosity softness test IMADA offers a high quality, high accuracy testing system for hand cream viscosity softness. Adhesive tape peel strength test This is the degree peel test of adhesive tape.

Adhesive tape degree peel bond strength test This is the degree peel test of adhesive tape.

A peel test part of ISO Cheese texture viscosity or hardness analysis This is the cheese texture viscosity or hardness analysis. Besides, 2 pieces of GC are necessary to perform this test.